Soft touch resin and transaction card comprising the same

ABSTRACT

Apparatuses and methods are provided for manufacturing a transaction card. The disclosed apparatuses and methods may be used to form a transaction card frame configured to house a data storage component. The card frame may be formed of a resin mixture comprising a thermoplastic elastomer (TPE). The card frame may also have a Shore D hardness in the range of 20-80.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Patent ApplicationSer. No. 62/432,094 filed Dec. 9, 2016, and is a continuation of U.S.Non-Provisional Patent Application Ser. No. 15/720,061 filed Sep. 29,2017, which also claims priority to U.S. Provisional Patent ApplicationSer. No. 62/432,094 filed Dec. 9, 2016, the contents of which are herebyincorporated in their entirety.

TECHNICAL FIELD

The disclosed embodiments generally relate to transaction cards, andparticularly, to transaction cards comprising a soft touch resin.

BACKGROUND

Transaction cards, such as credit and debit cards, have increasinglybecome a primary means for customers to complete financial transactions.Typically, transaction cards are cut from laminated sheets of polyvinylchloride (PVC) or polycarbonate (PC), or other similar materials. Afterthe overall shape of the card is formed, the card may be modified to addfunctional and/or visual features. For example, a magnetic strip and/ormicrochip may be affixed to one side, the card may be stamped with thecard number and customer name, and color or a design may be added forappearance.

In addition, as transaction cards increase in prevalence, expectationsfor transaction card quality have increased. Transaction cards haveincreasingly been made to meet higher standards regarding materials,durability, and overall “fit and finish.” Recently, heightenedexpectations of how a transaction card “feels” in a customer's hand,including aspects of tactile response and substance (i.e., weight) havegarnered the attention of card manufacturers. One particular goal ofcard manufacturers is to deliver cards that have a “soft touch” feel. A“soft touch” feel may be described as a haptic sensation that occurswhen a person touches something that, for example, feels soft, smooth,plush, and/or satiny.

Because PVC and PC transaction cards do not naturally provide a softtouch feeling, attempts to create a soft touch feel on PVC and PCtransaction cards have been made using special coatings or coatingadditives. For example, soft touch coatings comprising polyurethane havebeen developed, which can be sprayed over a transaction card to delivera soft touch feeling. Polyurethane additives have also been developed,which can be added to paints and protective coatings to provide a softtouch feel.

However, known specialized soft touch coatings and coatings modifiedwith soft touch additives do not meet manufacturers' standards ofdurability for use with transaction cards. That is, such coatings canwear out or the soft touch feel can be lost well in advance of theservice life of the transaction card. The application of soft touchcoatings also introduces additional steps in the manufacturing process,which can decrease throughput and increase manufacturing costs. Further,the application of additional layers to a transaction card can increasethe overall thickness of the card and affect card performance over thelife of the card.

The present disclosure is directed to overcoming one or more of theproblems set forth above and/or other problems associated withconventional transaction cards.

SUMMARY

The disclosed embodiments include a transaction card. The transactioncard can comprise a card frame that can be configured to house a datastorage component. In some aspects, the card frame may have a Shore Dhardness in the range of 20-80. In other aspects, the card frame mayhave a Shore D hardness in the range of 40-60.

The card frame can be formed of a resin mixture, and the resin mixturecan comprise a thermoplastic elastomer (TPE). The TPE can be a polyesterelastomer. The resin mixture can further comprise an acetal homopolymeror polybutylene terephthalate (PBT). The TPE can have a flexure modulusin the range of 500-1150 MPa. The TPE can further have a Shore Ahardness greater than 15 and a Shore D hardness less than 85. In otheraspects, the TPE can have a Shore D hardness in the range of 70-85. Theacetal homopolymer can have a Rockwell M hardness in the range of 18-94and a Rockwell R hardness in the range of 102-122. The PBT can have aflexural modulus in the range of 1600-8500 MPa and a flexural strengthin the range of 50-200 MPa.

In some aspects, the card frame of the transaction card can further beconfigured to house a transaction component. The card frame can, also,comprise a pocket. The pocket can comprise a first surface, a secondsurface, and a third surface. The second surface can be recessed a firstdepth from the first surface of the card frame, and the third surfacecan be recessed a second depth from the first surface of the card frame.The second depth may be greater than the first depth. In some aspects,the third surface can form a base portion of the pocket. The first depthcan be 0.21 mm with an error tolerance of ±0.02 mm, and the second depthcan be 0.62 mm with an error tolerance of ±0.02 mm. In some aspects, thesecond surface can be configured to house a contact plate of thetransaction component, and the third surface can be configured to housethe transaction component.

The transaction component can be a microchip or a communication device.In some aspects, the transaction component can comprise a Near FieldCommunication (NFC) device, an antenna, a Bluetooth® device, or a WiFidevice.

Consistent with another disclosed embodiment, a method of manufacturinga transaction card is provided. The method may include providing a resinmixture comprising a TPE. The method may further include forming a cardframe from the resin mixture, wherein the card frame is configured tohouse a data storage component. The card frame may have a Shore Dhardness in the range of 20-80.

The TPE can be a polyester elastomer. The resin mixture can furthercomprise an acetal homopolymer or polybutylene terephthalate (PBT). TheTPE can have a flexure modulus in the range of 500-1150 MPa. The TPE canfurther have a Shore A hardness greater than 15 and a Shore D hardnessless than 85. In other aspects, the TPE can have a Shore D hardness inthe range of 70-85. The acetal homopolymer can have a Rockwell Mhardness in the range of 18-94 and a Rockwell R hardness in the range of102-122. The PBT can have a flexural modulus in the range of 1600-8500MPa and a flexural strength in the range of 50-200 MPa.

In some aspects, the method can further include providing a moldcomprising a first plate configured to form the card frame. The methodcan further include forming a pocket on the card frame to house thetransaction component. The pocket can comprise a first surface, a secondsurface, and a third surface. The second surface can be recessed a firstdepth from the first surface of the card frame, and the third surfacecan be recessed a second depth from the first surface of the card frame.The second depth may be greater than the first depth. In some aspects,the third surface can form a base portion of the pocket. The first depthcan be 0.21 mm with an error tolerance of ±0.02 mm, and the second depthcan be 0.62 mm with an error tolerance of ±0.02 mm. In some aspects, thesecond surface can be configured to house a contact plate of thetransaction component, and the third surface can be configured to housethe transaction component.

The method can further include providing a transaction component thatcan be a microchip or a communication device. In some aspects, thetransaction component can comprise a Near Field Communication (NFC)device, an antenna, a Bluetooth® device, or a WiFi device.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory onlyand are not restrictive of the disclosed embodiments, as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate disclosed embodiments and,together with the description, serve to explain the disclosedembodiments. In the drawings:

FIG. 1 is a block diagram of an exemplary transaction system, consistentwith disclosed embodiments;

FIG. 2 is a front view of an exemplary transaction card frame,consistent with disclosed embodiments;

FIG. 3 is a back view of an exemplary transaction card frame, consistentwith disclosed embodiments;

FIG. 4 is a cross-sectional view of the exemplary transaction card framedepicted in FIG. 2, taken along line 4-4, consistent with disclosedembodiments;

FIG. 5 is a cross-sectional view of an exemplary mold, consistent withdisclosed embodiments;

FIG. 6 is an isometric and pictorial view of an exemplary milling setup,consistent with disclosed embodiments; and

FIG. 7 is a flowchart showing an exemplary method for forming atransaction card, consistent with the disclosed embodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to the disclosed embodiments,examples of which are illustrated in the accompanying drawings. Whereverconvenient, the same reference numbers will be used throughout thedrawings to refer to the same or like parts.

Disclosed embodiments include transaction cards and methods formanufacturing a transaction card. For example, disclosed embodimentsinclude a transaction card having a card frame configured to house adata storage component, wherein the card frame is formed of a resinmixture comprising a thermoplastic elastomer (TPE), and the card framehas a Shore D hardness in the range of 20-80. Disclosed embodiments alsoinclude a method of manufacturing a transaction card including the stepsof providing a resin mixture comprising a thermoplastic elastomer (TPE)and forming a card frame from the resin mixture, wherein the card frameis configured to house a data storage component, wherein the card framehas a Shore D hardness in the range of 20-80. Disclosed embodiments mayimprove transaction card performance and durability, and reduce costs orcomplexity of card manufacturing when compared to traditional processes.

The term “transaction card,” as used herein, may refer to any physicalcard product that is configured to provide information, such asfinancial information (e.g., card numbers, account numbers, etc.),quasi-financial information (e.g., rewards balance, discountinformation, etc.) and/or individual-identifying information (e.g.,name, address, etc.), when the card is read by a card reader. Examplesof transaction cards include credit cards, debit cards, gift cards,rewards cards, frequent flyer cards, merchant-specific cards, discountcards, identification cards, membership cards, insurance cards, anddriver's licenses, but are not limited thereto. For example, disclosedfeatures may be applicable to, for example, key fobs, cellular phonecases and covers, computer interface devices (e.g., keyboard, mouse,etc.), wallets, and/or other articles.

FIG. 1 illustrates an exemplary transaction system 10. Transactionsystem 10 may include a computing system configured to receive and sendinformation between the components of transaction system 10 and withcomponents outside of transaction system 10. Transaction system 10 mayinclude a financial service provider system 12 and a merchant system 14communicating with each other through a network 16. Transaction system10 may include additional and/or alternative components.

Financial service provider system 12 may include one or more computersystems associated with an entity that provides financial services. Forexample, the entity may be a bank, credit union, credit card issuer, orother type of financial service entity that generates, provides,manages, and/or maintains financial service accounts for one or morecustomers. Financial service accounts may include, for example, creditcard accounts, checking accounts, savings accounts, loan accounts,reward accounts, and any other types of financial service accounts.Financial service accounts may be associated with physical financialservice transaction cards, such as credit or debit cards that customersuse to perform financial service transactions, such as purchasing goodsand/or services online or at a point of sale (POS) terminal. Financialservice accounts may also be associated with electronic financialproducts and services, such as a digital wallet or similar account thatmay be used to perform electronic transactions, such as purchasing goodsand/or services online.

Merchant system 14 may include one or more computer systems associatedwith a merchant. For example, merchant system 14 may be associated withan entity that provides goods and/or services (e.g., a retail store).The merchant may include brick-and-mortar location(s) that a customermay physically visit and where the customer can purchase goods andservices using the transaction cards. Such physical locations mayinclude computing devices (e.g., merchant system 14) that performfinancial service transactions with customers (e.g., POS terminal(s),kiosks, etc.). Additionally or alternatively, merchant system 14 may beassociated with a merchant who provides an electronic shoppingenvironment, such as a website or other online platforms that consumersmay access using a computer through browser software, a mobileapplication, or similar software. Merchant system 14 may include aclient device, such as a laptop computer, desktop computer, smart phone,or tablet, which a customer may operate to access the electronicshopping mechanism.

Network 16 may include any type of network configured to facilitatecommunications and data exchange between components of transactionsystem 10, such as, for example, financial service provider system 12and merchant system 14. Network 16 may include a Local Area Network(LAN) or a Wide Area Network (WAN) such as the Internet. Network 16 maybe a single network or a combination of networks. Network 16 is notlimited to the above examples and transaction system 10 may implementany type of network that allows entities (shown and not shown) oftransaction system 10 to exchange data and information.

Transaction system 10 may be configured to conduct a transaction using atransaction card 20. In some embodiments, financial service providersystem 12 may provide transaction card 20 to a customer for use inconducting transactions associated with a financial service account heldby the customer. For example, the customer may use transaction card 20at a merchant location to make a purchase. During the course of thepurchase, information may be transferred from transaction card 20 tomerchant system 14 (e.g., a point of sale device). For example,transaction card 20 may include a transaction device, such as an EMVchip (Europay, MasterCard, Visa), an NFC (near field communication)device, a magnetic stripe (or “mag stripe”), or other type of deviceconfigured to store, transmit, send, or receive transaction date. Thetransaction device may be configured to exchange information withmerchant system 14 during the course of a transaction. Merchant system14 may communicate with financial service provider system 12 via network16 to verify the information and to complete or deny the transaction.For example, merchant system 14 may receive account information fromtransaction card 20. Merchant system 14 may transmit the accountinformation and a purchase amount, among other transaction information,to financial service provider system 12. Financial service providersystem 12 may settle the transaction by transferring funds from thecustomer's financial service account to a financial service accountassociated with the merchant.

While transaction system 10 and transaction card 20 are depicted anddescribed in relation to transactions that involve customers, merchants,and financial service providers, it should be understood that theseentities are used only as an example to illustrate one environment inwhich transaction card 20 may be used. Transaction card 20 is notlimited to financial products and may be any physical card product orother type of data storage and/or data transmission device that isconfigured to store, send, receive, represent, encode, decode, or beindicative of transaction information (or other information, such asidentification information, account information, membership information,and the like) when interacting with a corresponding reader device (e.g.,a card reader, NFC reader, EMV chip reader, or other media reader). Forexample, transaction card 20 may be an identification card configured toprovide information to a device in order to identify the holder of thecard (e.g., driver's license), an insurance card, membership card, acard indicating a licensure (e.g., a driver's license), or the like.Similarly, financial service provider system 12 and merchant system 14need not relate solely to financial transactions. As non-limitingexamples of these systems' non-financial aspects, financial serviceprovider system 12 may administer insurance plan accounts or licensures(e.g., the ability to do something, such as drive an automobile or buyfireworks), and merchant system 14 may read information from transactioncard, such as an identity or other information related to theowner/holder of the card.

In some embodiments, transaction card 20 may further include atransaction component 22 disposed on or in a transaction card frame(“card frame”) 24. As used herein, a “transaction component” may be oneor more devices and/or elements configured to receive, store, process,provide, transfer, send, delete, and/or generate information. Forexample, transaction component 22 may be a microchip (e.g., EMV chip), acommunication device (e.g., Near Field Communication (NFC) antenna,Bluetooth® device, WiFi device), etc. Transaction component 22 may besecured (or affixed, attached) to card frame 24 in such a way thatallows card frame 24 to carry transaction component 22 while maintaininga utility of transaction component 22 (e.g., allowing transactioncomponent 22 to interact with merchant system 14). (In some embodiments,transaction component 22 may be non-electronic, such as a magneticstrip, a barcode, Quick Response (QR) code.)

FIG. 2 is a front view of an exemplary card frame 24. FIG. 3 is a rearview of card frame 24. FIG. 2 shows a front side 26 of card frame 24 andFIG. 3 shows a rear side 28 of card frame 24. As shown in FIG. 2, cardframe 24 may include a pocket 30 configured to accommodate (or receive,affix, or secure) transaction component 22. Pocket 30 may includefeatures that accommodate a particular geometry of transaction component22 or enable transaction component 22 to be fixed (or secured, affixed,attached, or embedded) to card frame 24. For example, FIG. 4 shows across-sectional view of pocket 30 of the exemplary transaction card ofFIG. 2 along section line 4-4. The cross-sectional view of pocket 30shows several surfaces (e.g., surfaces 32, 34, and 36) at varying depthsfor accommodating transaction component 22, as discussed in furtherdetails below.

Card frame 24 may include an upper surface 32 (or first surface 32).Pocket 30 may include a second surface 34 recessed a first depth fromfirst surface 32 of card frame 24. Pocket 30 may also include a thirdsurface 36. Third surface 36 may be recessed a second depth from firstsurface 32. The second depth may be greater than the first depth. Thatis, third surface 36 may form a base portion of pocket 30, and secondsurface 34 may form an elevated surface at a certain height above thirdsurface 36. The dimensions and depths of second surface 34 and thirdsurface 36 may be set based on a plurality of criteria such as the sizeof a particular transaction component, industry standards, manufacturingtolerances, or other considerations. Based on the geometry of thetransaction component to be embedded in pocket 30, pocket 30 may includefewer (e.g., one) or more (e.g., three, four, etc.) surfaces recessedfrom first surface 32.

For example, in some embodiments, pocket 30 may be configured toaccommodate a microchip, such as an EMV chip. In these embodiments,first surface 32 may be referred to as P0. Second surface 34 may bereferred to as P1 and used as a glue layer for a contact plate of theEMV chip. Third surface 36 may be referred to as P2 and used as a deeperpocket to accommodate the depth of the EMV chip itself.

FIG. 4 illustrates a cross-sectional view of an exemplary embodiment ofcard frame 24 shown in FIG. 2 taken along line 4-4. FIG. 4 includes amagnified view of pocket 30 which illustrates surfaces 32, 34, and 36.As shown in the magnified view of pocket 30, second surface 34 isrecessed a first depth H1 from first surface 32, and third surface 36 isrecessed a second depth H2 from first surface 32. The dimensions (e.g.,widths and heights or depths) of surfaces 32, 34, and 36 may vary basedon the dimensions of the transaction component. For example, in someembodiments, first depth H1 may be 0.21 mm (with an error tolerance of+/−0.02 mm), and second depth H2 may be 0.62 mm (with an error toleranceof +/−0.02 mm).

Card frame 24 may be manufactured using a molding process, such as aninjection molding process or a compression molding process. Althoughinjection molding is discussed in detail as an example of the moldingprocess, some features discussed below may also be applied to thecompression molding process.

FIG. 5 is a cross-sectional view of an exemplary injection moldingsetup, which may include of a first plate 38 (or first component) of anexemplary mold 40 for manufacturing card frame 24. Mold 40 may beconstructed of any material or materials suitable for use as aninjection or compression mold, such as various grades of steel oraluminum. First plate 38 includes a surface 42 that defines firstsurface 32 of card frame 24. In some embodiments, surface 42 issubstantially flat. Surface 42 may include a protrusion structure 44protruding from the rest of surface 42. Protrusion structure 44 definesthe shape and dimension of pocket 30.

First plate 38 may include a gate 46 formed on surface 42. Gate 46 is anopening on surface 42, and is configured to receive a material forforming card frame 24 during the injection molding process. Gate 46 maybe connected with a channel 48 extending throughout the thickness offirst plate 38. First plate 38 may be configured to join with, connectto, or otherwise abut a second plate 50. Second plate 50 may include asurface 52. Surface 52 may include a shape corresponding to rear side 28of card frame 24 and may define rear side 28.

Gate 46 may be connected with channel 48 for receiving a material forconstructing or forming card frame 24 during a molding process. Forinstance, during manufacturing, a material for constructing card frame24 may be heated and injected through channel 48 and gate 46 such thatthe material fills a cavity 54 between surfaces 42 and 52, therebyforming card frame 24 with pocket 30.

In some embodiments, card frame 24 may be manufactured using a millingprocess, such as a computer numerical control (CNC) milling process oranother automated, semi-automated, or manual milling process. Forexample, with reference to FIG. 6, a CNC machine 56 or other type ofmill or milling machine may be used to mill card frame 24 from cardstock. Card stock may include a sheet or other piece of card materialthat has been molded, pressed, rolled or otherwise formed from desiredmaterials or ingredients for forming card frame 24. The milling processmay also include milling away a space (e.g., pocket 30) of a desiredsize for accommodating or receiving transaction component 22.

In some embodiments, one or more surfaces of pocket 30 may be formed bya molding process, and one or more surfaces of pocket 30 may be formedby a milling process. For example, one or more of surfaces 32, 34, and36 (referring to FIG. 4) may be formed during a preliminary moldingprocess, whereas one or more others of surfaces 32, 34, and 36 may besubsequently formed by a milling process after card frame 24 is removedfrom mold 40. In some embodiments, undesired or excessive materials maybe milled away from the interior of the recessed portion. For example,marks, such as those left by a gate or ejection pin may be milled awayafter the injection molding process is complete. Such defects may beminor such that they are considered acceptable or imperceptible oralternatively may be removed by corrective steps such as sanding,buffing, grinding, or milling.

In other embodiments pocket 30 may be fully formed without additionalmilling. As an example, mold 40 may produce card frame 24 of appropriatedimensions such that an EMV chip may be affixed within pocket 30 as anext step in a transaction card manufacturing process after removingcard frame 24 from mold 40.

To impart a soft touch feel on transaction card 20, card frame 24 may beformed of a material or combination of materials that inherentlypossesses soft touch qualities after the completion of the manufacturingprocess. That is, materials used in the injection molding process ormaterials from which card stock is made for the milling process may beselected such that the resulting card frame 24 possesses a soft touchfeel without the subsequent addition of special coatings or laminatesdesigned to impart a soft touch feel. In this way, the process ofmanufacturing a transaction card with a soft touch feel may besimplified by eliminating manufacturing steps. Additionally, the processof manufacturing a transaction card may be made less expensive byreducing manufacturing time and material costs (e.g., by requiring fewermaterials), as compared to known processes of producing a transactioncard with a soft touch feel (e.g., spray-on applications).

Additionally, soft touch qualities may impart transaction card 20 with ahigher coefficient of friction, which may advantageously reduceinstances of transaction card 20 being dropped and, as a result,becoming lost. That is, the soft touch materials disclosed herein may,in addition to providing a desired tactile quality to transaction card20, increase the coefficient of friction on card surfaces, which mayreduce the tendency of transaction card 20 to slip out from between auser's fingers or gloves, for example, when removing transaction card 20from its storage location (e.g., wallet, purse, pocket, ponecase/wallet, etc.) or when inserting and removing transaction card 20from a card reader (such as one associated with an ATM machine or othertransaction device). Additionally, instances of transaction card 20sliding across a surface, such as a counter, desk, or table, may bereduced, which may reduce instances of inadvertent misplacement oftransaction card 20.

In some embodiments, card frame 24 may be formed of a plastic resin. Theplastic resin used to form card frame 24 (i.e., the material used duringinjection molding or to make card stock for milling) may be a mixture ofdifferent raw materials and/or different resin mixtures. The componentsor ingredients of the plastic resin or resin mixture used to form cardframe 24 may be selected such that card frame 24 possesses desired softtouch qualities after formation by injection molding and/or milling iscomplete (i.e., without the performance of additional steps or theapplication of additional materials).

By forming card frame 24 from a soft touch resin, the soft touchqualities of card frame 24 may not be lost due to wearing (as is thecase with spray-on coatings) because the soft touch properties areinherent to the material from which the card frame is made. Further, noadditional steps beyond formation by injection molding and/or millingare needed to impart soft touch characteristics, which can reduce thecomplexity and cost of the manufacturing process. Additionally, byforming card frame 24 from a soft touch resin, the soft touch qualitiesof card frame 24 may be exhibited on every surface of card frame 24,instead of on only one side or the other (as is the case with currentspray-on techniques). By obviating the need for an additional soft touchcoating or laminate, forming card frame 24 from a soft touch resin mayallow for more precise tolerance control during the injection moldingand/or milling processes and may allow for more card stock material tobe present, thereby imparting a more substantial feel of the card to theuser.

In some embodiments, card frame 24 may be formed of a resin mixturecomprising a thermoplastic elastomer (TPE). TPEs may include types ofcopolymers and/or mixtures of polymers that exhibit properties ofthermoplastics and elastomeric materials. For example, the resin mixtureused to form card frame 24 may include a polyester elastomer, a blockcopolymer, a thermoplastic olefin, an elastomeric alloy, a thermoplasticpolyurethane, a thermoplastic copolyester, or a thermoplastic polyamide.

In an exemplary embodiment, the resin mixture used to form card frame 24includes a polyester elastomer, such as a commercially availablepolyester elastomer. Commercially available polyester elastomerssuitable for use in forming card frame 24 with a soft touch feel mayinclude Hytrel® 8238 made by DuPont®. Other suitable polyesterelastomers that are commercially available may include Hytrel® 7246 madeby DuPont®. While some commercially available TPEs are mentionedspecifically herein, other TPEs may be used in various embodiments.

In some embodiments, the TPE used to form card frame 24 may have a ShoreA hardness greater than 15, greater than 25, greater than 35, greaterthan 45, greater than 55, greater than 65, or greater than 75. In someembodiments, the TPE used to form card frame 24 may have a Shore Ahardness of less than 85, less than 75, less than 65, less than 55, lessthan 45, less than 35, or less than 25. As used herein, Shore A hardnessmay refer to durometer hardness on the Type A durometer scale (i.e.,durometer hardness determined using a durometer or micrometer accordingto the ASTM D2240 Type A durometer configuration). Depending on theselected TPE and/or other materials used in the resin for forming cardframe 24, the selected TPE may have a different Shore A hardness, ifdesired.

In some embodiments, the TPE used to form card frame 24 may have a ShoreD hardness less than 85, less than 80, less than 75, less than 70, lessthan 65, less than 60, or less than 55. In some embodiments, the TPEused to form card frame 24 may have a Shore D hardness of greater than50, greater than 55, greater than 60, greater than 65, greater than 70,greater than 75, or greater than 80. For example, the TPE used to formcard frame 24 may have a Shore D hardness of 70-85. As used herein,Shore D hardness may refer to durometer hardness on the Type D durometerscale (i.e., durometer hardness determined using a durometer ormicrometer according to the ASTM D2240 Type D durometer configuration).Depending on the selected TPE and/or other materials used in the resinfor forming card frame 24, the selected TPE may have a different Shore Dhardness, if desired.

The durometer hardness of a material may relate to or be indicative of asoft touch feel quality of the material. That is, to form card frame 24having a desired soft touch feel, the TPE may be selected based in parton the durometer hardness (e.g., a hardness value or range of values)associated with the TPE. Thus, the soft touch feel of card frame 24 maybe correlated to the durometer hardness of the TPE used therein. Forexample, a TPE with a low durometer hardness (e.g., a Shore A hardnessof less than 15) may impart less of a soft touch feel on card frame 24than a TPE with a higher durometer hardness (e.g., a Shore A hardnessgreater than 15 or a Shore D hardness of 70-85).

The durometer hardness of a material may also relate or be indicative ofa durability of the material. That is, materials with a higher durometerhardness may be more resistant to wearing (e.g., frictional wearing)than materials having a lower durometer hardness. Thus, in addition toimparting a soft touch feel, transaction cards consistent withembodiments of the present disclosure may experience additionalfunctional improvements tending to prolong the service life andreliability of transaction cards. For example, the durability of atransaction card having a frame formed of a resin that includes a TPE ofhigh durometer hardness (e.g., a Shore A hardness greater than 15 or aShore D hardness of 70-85) may be used (i.e., swiped, inserted, etc.)more times than a transaction card having a frame formed of a resin thatincludes a TPE of lower durometer hardness (e.g., a Shore A hardnessless than 15). As a result, transaction cards having a coatingconsistent with embodiments of the present disclosure, by way of theirimproved durometer hardness, may exhibit improved scratch resistance,reduced wearing of identification features (e.g., customer name, cardnumber, expiration date, etc.), less visible wear over time, enhancedlongevity of the transaction component (e.g., a mag stripe), and/orreduced wear experienced during storage (e.g., in a wallet).Additionally, the use of protective coatings and laminates may beforegone, thereby reducing the complexity of the manufacturing processand reducing overall manufacturing costs.

Adding other materials of different durometer hardness to the resin forforming card frame 24 (i.e., mixtures of the TPE with other materials ofdifferent durometer hardness) may influence (e.g., raise or lower) thedurometer hardness of card frame 24 with respect to the durometerhardness of any one of its constituent materials. For example, othermaterials, such as acetal homopolymers, polybutylene terephthalate(PBT), and/or other materials may be mixed with a TPE to form the resinfor forming card frame 24. Adding other such materials may impartdesired mechanical properties on card frame 24 while providing for anenhanced soft touch feel and durability in comparison to knowntransaction cards and card coatings.

For example, the resin mixture used to form card frame 24 (i.e., a resinmixture including a TPE and/or other materials) may be selected orconfigured to form a card frame having a Shore D hardness in the rangeof 20-80. In some embodiments, the Shore D hardness of card frame 24 maybe in the range of 20-80, 40-80, 60-80, 60-70, 40-60, 20-60, or 20-40.The transaction card of claim 1, wherein the card frame has a Shore Dhardness in the range of 40-60. Depending on the selected TPE and/orother materials used in the resin mixture for forming card frame 24,card frame 24 may have a different Shore D hardness, if desired.

In some embodiments, the TPE used to form card frame 24 may have aflexure modulus in the range of 500-1150 MPa. In this way, the TPE usedto form card frame 24 may be relatively flexible in addition to havingimproved soft touch feel and durability. For example, the TPE used toform card frame 24 may have a flexure modulus greater than 500 MPa,greater than 700 MPa, greater than 900 MPa, or greater than 1100 MPa. Insome embodiments, the TPE used to form card frame 24 may have a flexuremodulus less than 1150 MPa, less than 950 MPa, less than 750 MPa, lessor less than 550 MPa. Depending on the selected TPE and/or othermaterials used in the resin for forming card frame 24, the selected TPEmay have a different flexure modulus, if desired. Thus, in addition toachieving an improved soft touch feel, transaction cards having acoating consistent with embodiments of this disclosure may exhibitgreater durability, decreased tendency to crack or fracture when flexed,and greater resiliency to multi-axis flexure. In this way, the servicelife of transaction cards may be improved, thereby reducing overallcosts to manufacturers and consumers, and reducing inconvenient lapsesin card availability that occur after card failure and duringreplacement.

The resin mixture for forming card frame 24 may further includematerials for increasing the strength and durability of card frame 24.For example, the resin mixture for forming card frame 24 may include anacetal homopolymer. Acetal homopolymers may include commerciallyavailable acetal homopolymers, such as Delrin® made by DuPont®. Other ordifferent commercially available homopolymers may be used, if desired.

The acetal homopolymer used in the resin mixture for forming card frame24 may have a Rockwell M hardness in the range of 18-94. For example,the acetal homopolymer used in the resin mixture for forming card frame24 may have a Rockwell M hardness in the range of 18-94, 25-85, 35-75,45-65, or 50-55. As used herein, Rockwell M hardness may refer tohardness on the Rockwell M scale (i.e., hardness determined using asetup according to the Rockwell M configuration, such as defined by, forexample, ASTM D785). Depending on the selected acetal homopolymer and/orother materials used in the resin for forming card frame 24, theselected acetal homopolymer may have a different Rockwell M hardness, ifdesired.

The acetal homopolymer used in the resin mixture for forming card frame24 may have a Rockwell R hardness in the range of 102-122. For example,the acetal homopolymer used in the resin mixture for forming card frame24 may have a Rockwell R hardness in the range of 102-22, 105-120, or110-115. As used herein, Rockwell R hardness may refer to hardness onthe Rockwell R scale (i.e., hardness determined using a setup accordingto the Rockwell R configuration, such as defined by, for example, ASTMD785). Depending on the selected acetal homopolymer and/or othermaterials used in the resin for forming card frame 24, the selectedacetal homopolymer may have a different Rockwell R hardness, if desired.Enhanced Rockwell hardness may be indicative of improved tensilestrength, which may result in cards having reduced failure rates due toimpact forces, less visible damage over time, and a greater servicelife. As a result, fewer replacement cards may be issued, and overallcosts to manufacturers (and thus to consumers) may be reduced.

The resin mixture for forming card frame 24 may further include other oradditional materials for increasing the strength and durability of cardframe 24. For example, the resin mixture for forming card frame 24 mayinclude polybutylene terephthalate (PBT) or be mixed with materials thatinclude PBT. Suitable PBTs or materials that include PBT may includecommercially available PBTs, such as Crastin® made by DuPont®. Other ordifferent commercially available PBTs or materials that contain PBT maybe used, if desired. As used herein, reference to PBT should beunderstood to include materials containing PBT.

The PBT used in the resin mixture for forming card frame 24 may have aflexural modulus in the range of 1600-8500 MPa. For example, the PBTused in the resin mixture for forming card frame 24 may have a flexuralmodulus in the range of 1600-8500 MPa, 2000-8000 MPa, 2500-7500 MPa,3000-7000 MPA, 3500-6500 MPa, 4000-6000 MPa, 4500-5500 MPa, or 4750-5250MPa. Depending on the selected PBT and/or other materials used in theresin for forming card frame 24, the selected PBT may have a differentflexural modulus, if desired. Thus, transaction cards having a coatingconsistent with embodiments of this disclosure may exhibit a higherflexural modulus, and thus may be “stiffer,” as experienced bycustomers. In this way, the transaction card may feel more sturdy anddurable, which is an important customer achievement from a customersatisfaction point of view. Additionally, the stiffening experienced bycards employing the exemplary disclosed coating may resist flexure,thereby reducing instances in which the card experience high strain anddeformation. As a result, the transaction card may resist failure andlast longer.

The PBT used in the resin mixture for forming card frame 24 may alsohave a flexural strength in the range of 50-200 MPa. For example, thePBT used to for card frame 24 may have a flexural strength in the rangeof 50-200 MPa, 75-175 MPa, 100-150 MPa, or 120-130 MPa. Depending on theselected PBT and/or other materials used in the resin for forming cardframe 24, the selected PBT may have a different flexural strength, ifdesired. Improved flexural strength may increase the amount of toleratedstress and strain before the transaction card fails. Thus, by improvingthe flexural strength of the card, fewer failures may be experienced dueto excessive flexure or bending, which can occur inadvertently oraccidentally during normal card use. Further, a higher flexural strengthin combination with a higher flexural modulus, as discussed above, mayresult in compounded reductions in failure due to flexing and bending(i.e., by having greater resistance to bending as well as a highertolerance for bending and associated forces). Such improvements mayprolong the service life of transaction cards and reduce overall coststo manufacturers and consumers, while achieving greater customersatisfaction (i.e., for having reduced failures and associatedinconveniences).

The resin mixture for forming card frame 24 may include a mixture of TPEand one or more of acetal homopolymer and PBT. The resin mixture formingcard frame 24 may include a mixture having a 50:50 ratio, a 60:40 ratio,a 40:60 ratio, a 70:30 ratio, a 30:70 ratio, or another ratio of TPE toone or more of acetal homopolymer and PBT. The resin mixture for formingcard frame 24 may include other or additional materials, if desired.

While illustrative embodiments have been described herein, the scopeincludes any and all embodiments having equivalent elements,modifications, omissions, combinations (e.g., of aspects across variousembodiments), adaptations or alterations based on the presentdisclosure. For example, in some embodiments, a milling process may beused to form card frame 24 instead of an injection molding orcompression molding process. In other embodiments, different types ofTPEs than those mentioned herein may be used and or mixed with a PBT,acetal homopolymer, and/or other material. Various ratios of TPE toacetal homopolymer and/or PBT may be tested for soft touch feel,durability, strength, suitability in injection molding, and/or othercriteria.

FIG. 7 is a flowchart showing an exemplary method 700 for forming atransaction card. Method 700 may include providing a resin mixturecomprising a thermoplastic elastomer (TPE) (Step 7010). The TPE may be athermoplastic elastomer consistent with embodiments discussed above. Forexample, the TPE may be a polyester elastomer, such as Hytrel® oranother type of TPE. The TPE may have a flexure modulus in the range of500-1150 MPa. The TPE may also have a Shore A hardness greater than 15and a Shore D hardness less than 85. For example, the TPE may have aShore D hardness in the range of 70-85.

Step 7010 of providing a resin mixture may include providing a resinmixture comprising materials for increasing the strength and durabilityof card frame 24. For example, in addition to TPE, the resin mixture mayinclude acetal homopolymer, PBT, and or other materials. The acetalhomopolymer may have a Rockwell M hardness in the range of 18-94 and aRockwell R hardness in the range of 102-122. The PBT may have a flexuralmodulus in the range of 1600-8500 MPa and a flexural strength in therange of 50-200 MPa. Other types of acetal homopolymers, PBTs, and/orother materials may be included in the resin mixture, if desired.

Method 700 may further include forming a card frame from the resinmixture, wherein the card frame is configured to house a data storagecomponent and has a Shore D hardness in the range of 20-80 (Step 7020).For example, a resin mixture as described above may be injection moldedto form card frame 24. In other embodiments, the resin mixture may becompression molded or extruded. In other embodiments, the resin mixturemay be rolled, extruded, or otherwise processed to form sheets of cardstock. The card stock may be milled in a CNC, semi-automated, or manualmilling process. Features of card frame 24, such as pocket 30 may beformed during the molding process (e.g., the injection molding process)and/or during the milling process.

The elements in the claims are to be interpreted broadly based on thelanguage employed in the claims and not limited to examples described inthe present specification or during the prosecution of the application,which examples are to be construed as non-exclusive. It is intended,therefore, that the specification and examples be considered as exampleonly, with a true scope and spirit being indicated by the followingclaims and their full scope of equivalents.

1.-20. (canceled)
 21. A transaction card, comprising: a first side; asecond side, wherein a surface of at least one of the first side or thesecond side is formed of a resin mixture comprising thermoplasticelastomer (TPE) and at least one of acetal homopolymer or polybutyleneterephthalate (PBT), with a ratio of TPE to the at least one of acetalhomopolymer or PBT being between 30:70 and 70:30; a first transactioncomponent disposed on the first side of the card; and a secondtransaction component disposed on the second side of the card.
 22. Thetransaction card of claim 21, wherein the first transaction component isan electronic transaction component, and the second transactioncomponent is a nonelectronic transaction component.
 23. The transactioncard of claim 22, wherein the first transaction component comprises atleast one of a microchip, a communication device, a Near FieldCommunication (NFC) device, an antenna, a Bluetooth® device, or a WiFidevice.
 24. The transaction card of claim 22, wherein the secondtransaction component comprises at least one of a magnetic strip, abarcode, or a Quick Response (QR) code.
 25. The transaction card ofclaim 21, wherein the ratio of TPE to acetal homopolymer is between40:60 and 60:40.
 26. The transaction card of claim 21, wherein the TPEis a polyester elastomer.
 27. The transaction card of claim 21, whereinthe TPE has a flexural modulus in the range of 500-1150 MPa.
 28. Thetransaction card of claim 21, wherein the card has a Shore D hardness inthe range of 20-80.
 29. The transaction card of claim 21, wherein thecard has a Shore A hardness greater than 15 and a Shore D hardness lessthan
 85. 30. The transaction card of claim 21, wherein the acetalhomopolymer has a Rockwell M hardness in the range of 18-94 and aRockwell R hardness in the range of 102-122.
 31. A method ofmanufacturing a transaction card, comprising: forming a card comprisinga first side and a second side, wherein a surface of at least one of thefirst side or the second side is formed of a resin mixture comprisingthermoplastic elastomer (TPE) and at least one of acetal homopolymer orpolybutylene terephthalate (PBT), with a ratio of TPE to the at leastone of acetal homopolymer or PBT being between 30:70 and 70:30;disposing a first transaction component on the first side of the card;and disposing a second transaction component on the second side of thecard.
 32. The method of claim 31, wherein the first transactioncomponent is an electronic transaction component, and the secondtransaction component is a nonelectronic transaction component.
 33. Themethod of claim 32, wherein the first transaction component comprises atleast one of a microchip, a communication device, a Near FieldCommunication (NFC) device, an antenna, a Bluetooth® device, or a WiFidevice.
 34. The method of claim 32, wherein the second transactioncomponent comprises at least one of a magnetic strip, a barcode, or aQuick Response (QR) code.
 35. The method of claim 31, wherein the ratioof TPE to acetal homopolymer is between 40:60 and 60:40.
 36. The methodof claim 31, wherein the TPE is a polyester elastomer.
 37. The method ofclaim 31, wherein the TPE has a flexural modulus in the range of500-1150 MPa.
 38. The method of claim 31, wherein the card has a Shore Dhardness in the range of 20-80.
 39. The method of claim 31, wherein thecard has a Shore A hardness greater than 15 and a Shore D hardness lessthan
 85. 40. The method of claim 31, wherein the acetal homopolymer hasa Rockwell M hardness in the range of 18-94 and a Rockwell R hardness inthe range of 102-122.